Technological expertise

  • Micromachining by abrasive powder blasting of grooves, cavities, bores, and cuts.
  • Glass-to-glass or glass-to-silicon bonding with or without intermediate layers.
  • Deposition of metals by evaporation or electro-deposition.
  • Formulation of polymeric materials such as photosensitive polymers, adhesives, and dyes.

Machining characteristics

  • Machining depths = 2 mm.
  • Feature sizes = 100 µm.
  • Structural precision of ± 5 µm relative to the machining mask.
  • Taper angles from 10° to 25° depending on the material.
  • Roughness Ra of approximately 1.1 µm in glass.
  • Maximum aspect ratio of structures in glass of 1:1 for features < 200 µm and 2:1 for features = 200 µm.
  • Engraving accuracy of 20 µm or 10% of depth if depth > 200 µm.

Advantages provided by our machining technologies

  • Ability to machine complex shapes.
  • Anisotropic engraving with machining angles of approximately 15° in glass.
  • Since surfaces are protected and retain their original qualities, direct glass-to-glass bonding and encapsulation capabilities are preserved.
  • No thermal or mechanical stress induced.
  • No burrs.
  • Low cost.

Machinable materials

  • Hard ceramics such as aluminium nitride.
  • Fragile ceramics like piezoceramics (PZT), porous ceramics, and graphite.
  • Glass such as Borofloat 33, quartz, and other speciality glasses.
  • Semiconductors such as silicon and gallium arsenide (AsGa).
  • Natural materials such as mother-of-pearl and semi-precious stones like onyx and lapis-lazuli.
  • Precious metals and sintered oxides.
  • Plastics like PMMA, Epoxy, and PEEK.
An owl machined into glass

Copyright © 2022 IcoFlex Sàrl - Imprint