MICROMACHINING & FABRICATION
- Micromachining by abrasive powder blasting of grooves, cavities, bores, and cuts.
- Glass-to-glass or glass-to-silicon bonding with or without intermediate layers.
- Deposition of metals by evaporation or electro-deposition.
- Formulation of polymeric materials such as photosensitive polymers, adhesives, and dyes.
- Machining depths = 2 mm.
- Feature sizes = 100 µm.
- Structural precision of ± 5 µm relative to the machining mask.
- Taper angles from 10° to 25° depending on the material.
- Roughness Ra of approximately 1.1 µm in glass.
- Maximum aspect ratio of structures in glass of 1:1 for features < 200 µm and 2:1 for features = 200 µm.
- Engraving accuracy of 20 µm or 10% of depth if depth > 200 µm.
Advantages provided by our machining technologies
- Ability to machine complex shapes.
- Anisotropic engraving with machining angles of approximately 15° in glass.
- Since surfaces are protected and retain their original qualities, direct glass-to-glass bonding and encapsulation capabilities are preserved.
- No thermal or mechanical stress induced.
- No burrs.
- Low cost.
- Hard ceramics such as aluminium nitride.
- Fragile ceramics like piezoceramics (PZT), porous ceramics, and graphite.
- Glass such as Borofloat 33, quartz, and other speciality glasses.
- Semiconductors such as silicon and gallium arsenide (AsGa).
- Natural materials such as mother-of-pearl and semi-precious stones like onyx and lapis-lazuli.
- Precious metals and sintered oxides.
- Plastics like PMMA, Epoxy, and PEEK.
-Optimisation of designs for best fabrication results.
-Micro-structuring and cutting of parts in plates up to 200 mm.
-Production of prototypes at a few hundred wafers per month.
Contact us for more information